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| ZMD-Standard September 2002 Package TSOP (ll) 44 (400 mil) MDS 764 Dimensions in millimetres Based on JEDEC: JEP95 MO-133 1 Dimensions c Detail Z 44 E HE 1 0,1 e D bp 0,1 M A2 A Dimensions of Sub-Group B1 Amax bPmin bPmax enom HEmin HEmax LPmin 1,20 0,30 0,45 0,80 11,56 11,96 0,40 Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* 0,05 0,15 0,95 1,05 0,12 0,21 18,28 18,54 10,03 10,29 0 5 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,3 g Low Stress Epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends Dmax* Emin* Emax* qmin qmax * without mold-flash Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Check: signed Marx Date: 18.09.2002 Quality: signed Kochan Doc-No. QS-000764-HD-01 A1 LP G Z |
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